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TEEL Technologies Advanced BGA Chip-off Forensics

The new TEEL Tech Chip-Off Forensics Class provides students with a comprehensive education into performing forensics on BGA memory chips used in today’s mobile devices.

Students graduating the class will gain core competencies in:

  • Properly Removing a BGA Chip from a Device.
  • Handling and Preparing the Chip to be Read.
  • Reading the Chip to Acquire the Data.
  • Applying Tools and Techniques to Decode the Data.
  • Practicals on the Chip-off process of a locked unencrypted Blackberry and then utilizing forensic software to recover the logical and physical data dump.

The five-day class provides students with the skills required to properly remove a BGA memory chip from a mobile device, prepare the memory for a read, and use chip-reading equipment to acquire the data.Students will spend 2.5 days understanding the structure of devices and best practices to prevent damage to a chip during removal and preparation. Understanding the difference between memory structures -from mobile device, to tablet, to SSD hard drive – and how chip-off can be utilized to acquire data from a growing number of devices – the class enables examiners to get a handle on the growing trend of BGA memory use.

In the chip-reading portion of the class, students will learn the fundamentals of memory structure and how to utilize the tools available to read the memory off the chip. Students will get a complete hands-on experience beginning with an intact BlackBerry device loaded with data, and ending with the raw data acquired from the removed and read chip. Once the data is acquired, an education on how to best apply today’s tools and other techniques to decode the data follows.Students taking the Chip-off technique should possess advanced skills in data analysis and be comfortable working with raw data at the post-acquisition phase of the course.